Products

Laser marking machine for wafer HDZ-WAF500

Features

  • Single magazine loading and unloading mode: load, mark, and unload.
  • Fully-automatic loading and unloading, automatic edgesearching and positioning, simple operation and highefficiency
  • Compatible with 2-inch, 4-inch and 6-inch wafers
  • Small size, easy to place
  • Functions of automatic detecting magazine, automaticcounting, and double-side marking
  • Applicable for wafer edge marking

Application

  • HDZ-WAF500 is applicable for the 2-inch, 4-inch and6-inch wafer edge marking
  • HDZ-WAF600 is applicable for the 6-inch, 8-inch and12-inch wafer marking

specifications

Machine modelHDZ-WAF500
Laser typeFiber laser, CO  (optional)

2

Laser power (customized according

to the customer’s actual marking need)

Fiber 20W、CO2 10W
Cooling modeAir cooling
Final processing repeated positioning precision±0.2mm
Processing product type2 inch, 4 inch, 6 inch wafer
Power supply220V, 50Hz
Overall dimension (for reference)900mm*1150mm*1700mm

samples