HDZ-WUVC100
HDZ-WUVC100
Brief Description
Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing
Categories Wafer cutting
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Features:
1. With 355nm UV laser, the cutting machine has stable performance, good light spot, and long-time stable operation
2. The reliable and high-precision X-Y-Z-θ worktable and excellent accelerating and decelerating performance can efficiently improve the unit time productivity of system 
3. Through vacuum absorption, the wafer cannot move during platform moving
4. The wafer can be positioned through positioning the Mark point on the wafer, which can ensure the cutting precision
5. The high-efficient and flexible software operation system has a simple and concise interface
6. Automatic loading and unloading, robot carrying and automatic edge searching function
Specification:
Machine model HDZ-WUVC100 HDZ-WUVC200
Laser power 15W 15W
Laser wavelength 355nm 355nm
XY axis repeated positioning precision ±1µm ±1µm
θ axis repeated positioning precision ±15s ±15s
Cutting line width >15µm >15µm
Cutting depth >25µm >25µm
Cutting speed (*The cutting speed varies from different products) 100mm/s 100mm/s
Loading and unloading mode Manual Robot carrying; automatic edge searching
Processing product type 2 inch-12 inch wafers 2 inch-12 inch wafers
Power supply AC 220V,50Hz AC 220V,50Hz
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