Products Series
Products
Offline PCBA (FPCBA) Cutting machine HDZ-UVC3030
1. With high-performance UV lase and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
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EP-IRPS-20
1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics.
2. LCD, OLED screen cutting (C, R, U angle cutting).
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.
2. LCD, OLED screen cutting (C, R, U angle cutting).
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.
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Built-in flip PCB marking system HDZ-PCB100F
Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so on.
Marking on the Rigid and flexible printed circuit board (PCBAs).
Support 1D barcodes, 2D Matrix, QR codes, logo, batch number marking.
Marking on the Rigid and flexible printed circuit board (PCBAs).
Support 1D barcodes, 2D Matrix, QR codes, logo, batch number marking.
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Automated laser marking machine
1, High precision, precise pick and place, 8 materials flipped, laser marking on 3 sides synchronously.
2, High efficiency, 4 stations linkage, marking time 1.12pcs/s.
3, Strong stability, 99% product yield under high-speed operation.
2, High efficiency, 4 stations linkage, marking time 1.12pcs/s.
3, Strong stability, 99% product yield under high-speed operation.
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Semiconductor laser welder - WFD10/25/50/100/1000
The WFD series is a diode laser that uses diode materials to illuminate between energy bands. Two parallel mirror surfaces inside the diode are formed as a resonant cavity, which illuminates the light, and outputs laser of wavelength 915 nm.
With fiber t
With fiber t
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Online PCBA/FPCBA laser cutting machine HDZ-CL4030
Product Characteristics
1. With high-performance UV laser and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
1. With high-performance UV laser and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
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Ultrafast Glass Cutting and Drilling Machine HDZ-GCF3000
1、Glass thickness: 0.1-1.2mm
2、Edge breakage size: ＜0.005mm
3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL<50µm, T=0.7mm Corning
4、Non-contact processing, little damage to the material, high cutting precision.
2、Edge breakage size: ＜0.005mm
3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL<50µm, T=0.7mm Corning
4、Non-contact processing, little damage to the material, high cutting precision.
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Laser drilling machine
1.Realize X, Y, Z motion control in three directions;
2.Real-time controls the rotation of the laser and changes of processing tilt angle;
3. By setting different combination of processing parameters, users can realize various irregular drilling.
2.Real-time controls the rotation of the laser and changes of processing tilt angle;
3. By setting different combination of processing parameters, users can realize various irregular drilling.
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Elfin Series
Elfin series 6 axis collaborative robot can be applied to automatically integrated production line, assembling, picking, welding, grinding, painting and other fields, successfully exported to more than 50 countries and regions including Europe, USA ,Jap
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PD5050-HLR-150
It is mainly used for laser cutting of metal plates such as stainless steel plates, ordinary carbon steel plates, aluminum plates, nickel plates, etc.; it cannot be used for processing containers of metals and alloys with flammable and explosive materials
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PD5060-CO2-60-CCD
Laser cutting is the process of cutting material by means of electron discharge as the energy source. The following diagram describe the principle of Laser cutting Succinctly.
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PL30-HLR-150
Mainly used for laser cutting of metal sheet, such as stainless steel, plain carbon steel plate, aluminum plate, etc.;
Can be used to cut aluminum oxide, aluminum nitride ceramics.
Cutting Product Industry:
IT industry products, such as laptops, mobile
Can be used to cut aluminum oxide, aluminum nitride ceramics.
Cutting Product Industry:
IT industry products, such as laptops, mobile
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Trim automated assembly machine
The machine is mainly used in the assembly and welding of the fixed structure parts of the back cover camera of IT products such as mobile phones and PAD.
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Rcam Trim automated assembly machine
The machine is mainly used in the assembly and welding for the fixed structure parts of the back cover camera of IT products such as mobile phones and PADs.
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MARS-10J/20J
1. Can be suitable for a variety of materials: steel, aluminum, silver, gold, silicon.
2. Suitable for various industries:
Electronic components industry
Medical device industry
Glasses, watch and clock industry
IC card industry
Jewelry industry
2. Suitable for various industries:
Electronic components industry
Medical device industry
Glasses, watch and clock industry
IC card industry
Jewelry industry
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EP-15-THG-S
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
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YLP-MDF-152
The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch industry, jewelry industry, mould industry etc.
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EP-15-THG-F
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
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EP-15-THG-D
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
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Applications
About Us
HAN'S LASER INTRODUCTION
Han's Laser Technology Industry Group Co., Ltd, a public company which was established in 1996, has now became the flagship of Chinese national laser industry and the world's famous laser equipment manufacturer.
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2486
Patent
10746
Professional
500000
Research
News
Technical difficulties and solutions of laser welding of red copper
Red copper material is widely used in the industry. It has excellent thermal conductivity, conductivity and ductility, and it also has good corrosion resistance. It is often used in sanitary ware, kitchen and marine industry. Red copper is relatively easy to be processed by casting, welding and cutting, which is also a major reason for its widespread use.
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Uncover the secrets of button battery laser welding, helping the era of intelligent wearing
In recent years, with the explosion of TWS earphones, new rechargeable button batteries with advantages such as high endurance, high safety and personalization have been unprecedentedly popular in various small wearable devices such as TWS earphones, smart watches, smart glasses and smart speakers.
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