HDZ-WAF600
Brief Description
Applicable for the 6-inch, 8-inch and 12-inch wafer marking
Categories
PCBA & IC & Wafer marking
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Features:
1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking.
2. Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency.
3. The whole system adopts computer control, Windows operation platform，interface in English, self-developed software, easy to operate.
4. With high automation, it has the function of automatic fault alarm.
5. Precise marking to the product DIE.
2. Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency.
3. The whole system adopts computer control, Windows operation platform，interface in English, self-developed software, easy to operate.
4. With high automation, it has the function of automatic fault alarm.
5. Precise marking to the product DIE.
Specification:
| Machine model | HDZ-WAF500 | HDZ-WAF600 |
| Laser type | Fiber laser, CO2 (optional) | UV, green light (optional) |
| Laser power (customized according to the customer’s actual marking need) | Fiber 20W、CO2 10W | UV 7W, green light 10W |
| Cooling mode | Air cooling | Water cooling |
| Final processing repeated positioning precision | ±0.2mm | ±0.05mm |
| Processing product type | 2 inch, 4 inch, 6 inch wafer | 6 inch, 8 inch, 12 inch wafer |
| Power supply | 220V, 50Hz | 220V, 50Hz |
| Overall dimension (for reference) | 900mm*1150mm*1700mm | 1950mm*1650mm*1635mm |
Sample
Wafer marking
Wafer marking
Dot matrix character marking
Wafer marking
