HDZ-SIC200
HDZ-SIC200
Brief Description
Applicable for the packaged IC marking of DIP, QFN and BGA.
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Features:
1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, sampling inspection function of marking effect
2. Friendly HMI
3. Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional
4. With special fume removal device, it can quickly extract the fume and dust produced during marking to protect the marking area environment
5. It complies with CE MARK and SEMI standard
Specification:
Machine model HDZ-SIC100 HDZ-SIC200
Marking scope 320mm*160mm 320mm*160mm
Product specification L: 160-320mm; W: 30-80mm L: 160-320mm; W: 30-80mm
Font TFT and SHX; with font library module modification program
Final processing repeated positioning precision ±0.1mm ±0.1mm
UPH 1200 pieces/h (idle) 1200 pieces/h (idle)
Power supply AC 220V, 50/60Hz AC 220V, 50/60Hz
Air source 0.6-0.8 MPa 0.6-0.8 MPa
Overall dimension 2525mm*1665mm*2000mm 2515mm*1420mm*2000mm
Sample
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