Products Laser Cutting Equipment Wafer & PCBA Laser Cutting Equipment
HDZ-WUVC100

Wafer Laser Cutting Machine

HDZ-WUVC100

Machine Features

1. 355nm UV laser, long-time stable performance, good light spot

2. Reliable and high-precision X-Y-Z-θ worktable, excellent accelerating and decelerating performance, improved productivity

3. Wafer fixation via vacuum absorption during platform movement

4. Wafer positioning via wafer markpoint positioning for cutting precision assurance

5. High-efficient and flexible software operation system with simple-concise interface

6. Automatic loading/unloading, robot carrying and automatic edge searching


Applications

Applicable to 2 inch, 4 inch, 8 inch and 12 inch wafer cutting

Technical Data Sheet

Machine model

HDZ-WUVC100

HDZ-WUVC200

Laser power

15W

15W

Laser wavelength

355nm

355nm

XY axis repeated positioning precision

±1µm

±1µm

θ axis repeated positioning precision

±15s

±15s

Cutting line width

>15µm

>15µm

Cutting depth

>25µm

>25µm

Cutting speed (*The cutting speed varies from different products)

100mm/s

100mm/s

Loading and unloading mode

Manual

Robot carrying; automatic edge searching

Processing product type

2 inch-12 inch wafers

2 inch-12 inch wafers

Supply Voltage, Electricity Demand

AC 220V，50Hz

AC 220V，50Hz

 


Laser Cutting Effects

Wafer cutting sample
Wafer cutting sample
Wafer cutting sample
Wafer cutting sample

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