Products Laser Cutting Equipment Wafer & PCBA Laser Cutting Equipment
HDZ-UVC3030

Offline Small-Format PCBA/FPCA Laser Cutting Machine

HDZ-UVC3030

Machine Features

1. Self-developed high-performance UV laser generator wiht very small heat-affected zone, enabling more efficient processing of high-density, highly integrated PCBA products.

2. High-precision motion system with high-precision scanning galvanometers and vision positioning system assuring cutting accuracy

3. Self-developed control software with multi‑jointed panel cutting, automatic focusing, distortion compensation and other functions to meet diverse cutting requirements of complex products.


Applications

1. Suitable for precision cutting, half‑cutting and grooving of materials such as FPCBA, PCBA, RF materials, CVL and SIP 2. Suitable for the high-quality cutting of Coverlay, PI, FR4, FR5 and CEM materials 3. Suitable for the precise processing of electronic industry such as mobile phone fingerprint module, camera module, integrated circuit chips.

Technical Data Sheet

Equipment Model

HDZ-UVC3030/HDZ-UVC3030B

Laser Generator

UV (Green nanosecond or UV picosecond)

Laser Power

20-60W

Minimum Line Width

0.03mm

Repeat Positioning Accuracy

±0.02mm / ±0.05mm

Maximun Processing Area

300mm*300mm

Positioning System

Visual Camera Positioning

Cooling Method

Water-Cooling

Dimensions

1000mm*1100mm*1750mm


Laser Cutting Effects

Recommended Products

HDZ-WUVC100

HDZ-CL4030

HDZ-UVC3040D

HDZ-CCM200
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