Products Laser Cutting Equipment Wafer & PCBA Laser Cutting Equipment
HDZ-CL4030

Online Small-Format PCBA/FPCA Laser Cutting Equipment

HDZ-CL4030

Machine Features

1. Self-developed high-performance UV laser generator with very small heat-affected zone, enabling more efficient processing of high-density, highly integrated PCBA products

2. High-precision motion system with high-precision scanning galvanometers and a vision positioning system equipped, assuring cutting accuracy

3.  Can be embedded in the SMT production line and connected to the loading/unloading mechanism, reducing human intervention and improving production stability


Applications

1. Suitable for precision cutting, half cutting, grooving of materials such as FPCBA, PCBA, RF, CVL and SIP 2. Suitable for the product precise processing in auto industry and electronic industry

Technical Data Sheet

Machine Model

HDZ-CL4030                                                                 

Laser Generator

UV (Green nanosecond or UV picosecond) 

Laser Power

20-60W

Minimal Line Width

0.03mm

Repeat Positioning Accuracy

±0.025mm    

Maximal Processing Area

300mm*300mm  

Positioning System

Visual Camera Positioning

Cooling Method

Water-Cooling

Dimensions

1000mm*1400mm*1750mm   


Laser Cutting Effects

PCBA cutting
PCBA cutting
FPCBA cutting
FPCBA cutting
Camera PCBA cutting
Camera PCBA cutting

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