Products Laser Cutting Equipment Wafer & PCBA Laser Cutting Equipment
HDZ-CCM200

Automatic CCM Laser Cutting and SMT Equipment

HDZ-CCM200

Machine Features

1. Fullyautomatic dualworktable operation, effectively reduced loading/unloading standby time.

2. Automatic sorting & nesting and AOI inspection functions equipped


Technical Data Sheet

Equipment Model

HDZ-CCM200

Laser Generator

UV

Laser Power

20W

Minimum Line Width

0.03mm

Repeat Positioning Accuracy

±0.03mm

Maximum Processing Size

240mm*200mm*2

Positioning System

Visual Camera Positioning

Cooling Method

Water-Cooling

Dimensions

2800mm*2200mm*2065mm


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