Products Laser Cutting Equipment Wafer & PCBA Laser Cutting Equipment
HDZ-UVC3040D

Double Load Table PCBA/FPCA Laser Cutting Equipment

HDZ-UVC3040D

Machine Features

1. Self-developed high-performance UV laser generator with very small heat-affected zone, enabling more efficient processing of high-density, highly integrated PCBA products.

2. High-precision motion system with high-precision scanning galvanometers and a vision positioning system equipped, assuring product processing accuracy.

3. Can be embedded in the SMT production line and connected to the loading/unloading mechanism, reducing human intervention and improving production stability.

4. Safety light curtain and a dual worktable processing method, effectively reduced loading/unloading downtime and improved processing efficiency


Technical Data Sheet

Equipment Model

HDZ-UVC3040D

Laser Generator

                        UV (Green nanosecond or UV picosecond)                     

Laser Power

20-60W

Minimum Line Width

0.03mm

Repeat Positioning Accuracy

 ±0.03mm

Maximum Processing Area

 300mm*400mm*2

Positioning System

Visual Camera Positioning

Cooling Method

Water-Cooling

Dimensions

1370mm*1760mm*1825mm


Laser Cutting Effects

Recommended Products

HDZ-UVC3030

HDZ-WUVC100

HDZ-CL4030

HDZ-CCM200
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