HANS-H585

Features：

• Support max 100mm leadframe;
• Equipped with dual frequency ultrasonic transducer, greatly improving product adaptability;
• Piezo-ceramic lightweight wire clamp, no need to correct the wire clamp gap to accommodate the switching of various wire;
• Fully automatic temperature adaptive system, improve bonding precision;
• Fuily intelligent and high sensitivity Bond Stick Detect system,more convenient;
• Independently research and development HMC operation and control system, improve force control accuracy and stability;
• New ultra high speed XY platform, fast, stable, and gas saving;
• Equipped with dual-path lens that can be adapted to multi-layer chipset products.

Product advantages:

• Support ultra-wide leadframe;
• Adapt to more diverse IC products;
• Micron-level bonding accuracy, strictly in line with the bonding requirements of IC products;
• Good stability and low maintenance costs.