Leveraging the extremely small heat-affected zone of "cold processing", it can achieve ultra-fine processing and microstructure production of non-metallic brittle materials in the high-end manufacturing fields, which is widely used in the 3C industry, especially in the key processes of cellphone industry chain. At present, more than 15,000 machines have been launched, leading the market share of similar lasers.

Applications
1.    PCB, FPC marking, de-panel, cutting and drilling;
2.    Silicon wafer micro-hole and blind hole processing;
3.    Solar cell process
4.    Silicon wafer scribing
5.    Ceramic scribing, cutting and drilling
6.    Removal of printing ink, PVD coating
7.    Material surface marking
 

Model	HL-NS-355-5/10/15	HL-NS-355-20
Output parameters
Wavelength	355nm
Power	5W/10W/15W	20W
Repetition frequency	10-200 kHz	60-400khz
Pulse width	10-100ns	20-100ns
Pulse stability	<3%rms,1σ	<3%rms,1σ
Beam parameters
Spatial pattern	TEM00
M2	<1.3
Polarization ratio	100:1 (horizontal)
Spot diameter	1.1 mm ±0.1mm	1.4mm ±0.2mm
Divergence full angle	<2 mrad
Spot symmetry	>90%
Beam pointing	<± 25 µrad/°C
Working conditions/requirements
Power supply	100-240V,50 -60Hz
Ready time	Standby to ready<10 minutes; Cold start to ready<30 minutes
Temperature range	Working: 18~35°C; Non-working: 0~50°C
Humidity	10—90%, no condensation
Cooling requirements	Water cooling, chiller accuracy ±0.1°C & flow rate≥6L/min
Overall heat consumption	<1000 W
Size
Size of laser head (L × W × H)	500mm×230.5mm×132mm
Weight of laser head	18kg
Size of controller (L × W × H)	477 mm× 440mm × 177mm
Weight of controller	21kg