Laser screen plate cutting machine for PI film/Steel Mesh.

Brief Description

Mainly used for laser pattern processing of solar screen printing PI film material screen or stencil removal for meshless screen production

Categories PV Industry

Main Features
Good processing quality: no burning, no glue residue, good line width consistency in film cutting; no residue in steel mesh cutting, less dust adhesion;
High flexibility: Compatible with conventional screen and non-knotted screen, you can choose a variety of cutting methods;
High precision: high-precision CCD positioning system + high-precision XY platform (repeated positioning accuracy ±1um).

Main Parameters

Project	Solar screen film cutting machine	Solar Mesh Stencil Cutting Machine
Processing object	Screen PI film	Knot-free mesh
Technical indicators	The taper of fine grid/anti-break grid/gradient grid can be adjusted from 6-8um; The total taper of both sides of busbar cutting is less than or equal to 10um; Fine grid incision width tolerance ±1um; Overall graphic cutting size error ±5um	Warp cutting number: 2 or 3 optional With the function of software to automatically correct the number of cutting strips
Processing quality	No burning, no wire damage, no glue residue	No residue, no obvious burrs
efficiency	About 30min (according to the complexity of the graphics and size differences, time will vary)	About 30min (according to product size differences, time will vary)