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Wafer Marking Machine

HDZ-9221

Machine Features

1. For semiconductor wafer DIE marking, compatible with 8/12-inch wafers, Si, EMC, solder mask materials; supports obverse/reverse marking, bare die & film-through marking processes

2. Fully automatic operation with dual-arm manipulator for high productivity

3. Optional Load Port / SMIF loading module

4. Built-in power inspection system to guarantee consistent marking quality

5. SECS-GEM communication protocol supported

Applications

For DIE marking of 12-inch and smaller wafers including Si, GaAs, SiC, EMC and solder mask materials.

Cookies Consent

Han's Laser Solutions

Wafer Marking Machine

HDZ-9221

Applications

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