HDZ-9222

Automatic Wafer ID Laser Marking Machine

HDZ-9222

Machine Features

1. Compatible with 8-inch and less wafer, optional load port compatible with 12-inch wafer

2. Double arm manipulator, effectively improved processing efficiency

3. Special calibrator equipped, able to set edge marking position flexibly

4. Electric focusing mechanism, able to adjust height according to product thickness

5. Manipulator equipped with Mapping function to detect laminated and misaligned pieces

Technical Data Sheet

Machines model  

HDZ-9222

Laser wavelength   

UV, green and infrared laser sources
 355nm、532nm、1064nm

Feeding mode  

Double arm manipulator

Cooling mode

Air cooling / Water cooling

Final processing repeated positioning precision   

±0.1mm

Processiong product type    

8-inch and less wafer(optional Loadport compatible with 12-inch wafer

Number of wafers processed per hour  

120-150pcs

Support file format

dxf,plt

Power supply

AC/220V, 50/60Hz

Air supply

0.6-0.8MPa

Overall dimension

 2000mm*1200mm*1850mm


Laser Marking Effects