

1. Compatible with 8-inch and less wafer, optional load port compatible with 12-inch wafer
2. Double arm manipulator, effectively improved processing efficiency
3. Special calibrator equipped, able to set edge marking position flexibly
4. Electric focusing mechanism, able to adjust height according to product thickness
5. Manipulator equipped with Mapping function to detect laminated and misaligned pieces
Machines model | HDZ-9222 |
Laser wavelength | UV, green and infrared laser sources |
Feeding mode | Double arm manipulator |
Cooling mode | Air cooling / Water cooling |
Final processing repeated positioning precision | ±0.1mm |
Processiong product type | 8-inch and less wafer(optional Loadport compatible with 12-inch wafer |
Number of wafers processed per hour | 120-150pcs |
Support file format | dxf,plt |
Power supply | AC/220V, 50/60Hz |
Air supply | 0.6-0.8MPa |
Overall dimension | 2000mm*1200mm*1850mm |