Products Laser Marking Equipment PCBA & IC & Wafer Laser Marking Machine
HDZ-WAF600

Fully Automatic Wafer Laser Marking Machine

HDZ-WAF600

Machine Features

1. Green laser or UV laser, fine focusing spot is, non-contact marking

2. Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency

3. Computer control system, Windows operation platform，interface in English, self-developed software, easy to operate.

4. High automation, automatic fault alarm function

5. Precise marking to the product DIE.

Applications

Applicable to the 6-inch, 8-inch and 12-inch wafer marking

Technical Data Sheet

Machine Model

HDZ-WAF500

HDZ-WAF600

Laser Type

Fiber laser, CO2  (optional)

UV, green light (optional)

Laser Power (customized according to the customer’s actual marking need)

Fiber 20W、CO2 10W

UV 7W, green light 10W

Cooling Mode

Air cooling

Water cooling

Final Processing Repeated Positioning Precision

±0.2mm

±0.05mm

Processing Product Type

2 inch, 4 inch, 6 inch wafer

6 inch, 8 inch, 12 inch wafer

Power Supply

220V, 50Hz

220V, 50Hz

Overall Dimension (for Reference)

900mm*1150mm*1700mm

1950mm*1650mm*1635mm


Laser Marking Effects

Wafer marking
Wafer marking
Wafer marking
Wafer marking
Dot matrix character marking
Dot matrix character marking
Wafer marking
Wafer marking

Recommended Products

HDZ-PCB100F

HDZ-SIC200

HDZ-PCB6565AL

HDZ-FPC4530D

Double-sided PCBA laser marking

HDZ-8221

HDZ-MDP200

HDZ-9222

HDZ-9121
Contact Us
Sales Hotline
+86-400-666-4000