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Medium-Power Femtosecond Laser
Femto-10

Medium-Power Femtosecond Laser

Femto-10

Machine Features

1. Advanced Chirped Pulse Amplification (CPA) technology and multiple self-developed technologies, having prominent advantages in machining performance with stable operation, achieving industry-leading technology globally.

2. All-fiber optical path design featuring high stability, broad applicability and maintenance-free operation. Equipped with an in-house developed high-stability seed source; over one thousand units have been used with long-term reliable operation.

3. Tunable pulse width ranging from 600 fs to 30000 fs; tunable repetition rate covering 50 kHz–2 MHz.

4. Self-developed laser beam shaper optimizes beam quality to M²≤1.1 in both horizontal and vertical axes, while ensuring beam circularity above 95%.

5. Self-developed electronic control and software systems support rapid modulation of pulse train delay time, enabling tuning of laser pulse width and pulse energy.


Applications

Cutting (glass, ceramic, sapphire, plastic)

Marking (glass, silicon, ceramic, metal, plastic)

Thin-film patterning (metals, thin films, solar cells)


Technical Data Sheet

Machine Model

Medium-Power Femtosecond Laser Femto-10

Operating Mode

Pulsed

Average Power(W)

20w@800kHz

Central Wavelength(nm)

1030

Number of Output Pulses

1-20

Repetition Rate(kHz)

50-2000; Tunable

Pulse Width(fs)

600-30000fs; Customizable

Power Tuning Range(%)

0-100

Polarization

Linear Polarization; Vertical or Horizontal Optional

Beam Quality(M2)

≤1.1

Power Stability(%)

≤1%; 24h

Beam Spot Size(mm)

1.9±0.3; 1/e2

Beam Ellipticity(%)

>95

Beam Divergence Angle(mrad)

<0.8

Operating Voltage(V)

220

Power Consumption(W)

<500

Cooling Method

Water Cooling, Purified Water

Operating Temperature(℃)

10~30

Storage Temperature(℃)

10~40

Operating Ambient Humidity(%)

10~60

Dimensions(mm)

780*514*230

Weight(kg)

75±0.2

 


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