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Single-Station Solder Ball Soldering System

Machine Features

1.Single-station integrated design with compact structure, flexible and convenient

2.Fast solder ball spraying

3.Stable and reliable solder ball distribution

4.Contact‑free, no residue after welding

5.Small thermal impact and high welding yield

6. Easy and convenient maintenance

Applications

Welding in 3C electronics industry, especially for wearable devices such as TWS headsets, watches, VCM, CCM, chip BGA packaging and more.

Brief Description

High integration with a compact structure, the system features a lightweight design, high efficiency and stable solderball jetting speed, enabling flexible layout for production and experimental testing.

Technical Data Sheet

Machine Model	Single-Station Solder Ball Soldering System
Solder Ball Diameter	0.15mm-0.6mm (Other diameters are customizable)
Spraying Speed	3-5balls/s
Nozzle Life	200,000-400,000 times
Welding Yield	Above 99%
Repeated Positioning Accuracy	±0.01mm
Welding Range	200mm*200mm (Customizable)
CCD Positioning CCD	5 M pixels
Dimensions	980mm1000mm1900mm
Total Weight	450KG
Supply Voltage, Electricity Demand	AC220V,15A,50Hz

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Han's Laser Solutions

Single-Station Solder Ball Soldering System

Applications

Brief Description

Laser Welding Effects

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