Single-Station Solder Ball Soldering System

Machine Features

1.Single-station integrated design with compact structure, flexible and convenient

2.Fast solder ball spraying

3.Stable and reliable solder ball distribution

4.Contactfree, no residue after welding

5.Small thermal impact and high welding yield

6. Easy and convenient maintenance


Applications

Welding in 3C electronics industry, especially for wearable devices such as TWS headsets, watches, VCM, CCM, chip BGA packaging and more.

Brief Description

High integration with a compact structure, the system features a lightweight design, high efficiency and stable solderball jetting speed, enabling flexible layout for production and experimental testing.
Technical Data Sheet

Solder Ball System

Solder Ball Diameter

0.15mm-0.6mm

Other diameters are customizable

Spraying Speed

3-5balls/s


Nozzle Life

200,000-400,000 times


Welding Yield

Above 99%


Motion Section

Repeated Positioning Accuracy

±0.01mm


Welding Range

200mm*200mm

Customizable

CCD

Positioning CCD

5 M pixels


System Structure

Dimensions

980mm*1000mm*1900mm


Total Weight

450KG


Supply Voltage, Electricity Demand

AC220V,15A,50Hz



Laser Welding Effects