Cookies Consent

Required Cookies (Necessary)
Optional Cookies (statistical analytics cookies)

Enabling this setting confirms your approval for cookie implementations throughout the Han’s Laser website, together with the transfer of your personal data to third countries. You may withdraw this authorisation via this interface at any time. Kindly note that all data processing undertaken pursuant to this consent shall remain legally valid prior to your withdrawal.

Privacy Policy Legal Statement
High-Speed Solder Ball System Module
Products Laser Welding Equipment Soldering and Special Laser Welding Machines

High-Speed Solder Ball System Module

Machine Features

1. Modular design for easy integration with automation lines.

2. Multiple optical path combination modes optional.

3. Fast solder ball ejection with stable and reliable ball separation.

4. Non-contact processing leaves no residues after soldering.

5. Low heat-affected zone for high welding yield.

6. Lightweight and compact structure with simple maintenance.


Applications

Mainly applied to the 3C electronics industry, especially wearable devices including TWS earbuds, smart watches, VCM, CCM, and chip BGA packaging.


Recommended Products

Dual-Station Constant Temperature Solder Paste Welding System

Single-Station Solder Ball Soldering System

Dual-Station Constant Temperature Solder Ring Welding System

Dual-Station Laser Welding System for Mobile Phone Structural Components

Mobile Stud Laser Welding System

High Power Laser Welding System For Mobile Phone Structural Components

Strip Laser Splicing Welding System

Fully Automatic Laser Solder Ball Jet Welding System
Contact
Contact Us
Phone
Sales Hotline
+86-400-666-4000
Top