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1. Wide material compatibility, compensating for insufficient processing capacity of infrared lasers.
2. Superior beam quality with tiny focused spots, enabling ultra-fine marking.
3. Minimal heat-affected zone prevents workpiece damage and delivers high finished product yield.
4. Consumable-free operation, low operating and maintenance costs.
5. Stable overall machine performance, supporting long-term continuous operation.
6. One-key power on/off function, easy operation
1. Logo marking on surfaces of high-end electronic products
2. Marking for food packaging, PVC pipes, pharmaceutical packages, wires and cables (HDPE, PO, PP and other materials)
3. QR code marking on PCB & FPC
4. Coating removal on metallic and non-metallic materials
5. Marking for air switches and low-voltage electrical appliances (flame retardant materials)