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1. Compatible with green, UV, IR nanosecond laser units
2. Equipped with protective cover to block laser radiation
3. Dual-station design reduces loading/unloading time & improves productivity
4. Fitted with safety light curtains and control switches for operator safety
1. Marking of electronic product logos, model numbers, origin info and other identifiers
2. Marking & micro-hole drilling on food materials, PVC pipes, medical materials (HDPE, PO, PP, etc.); hole diameter d ≤ 10 μm
3. Coating removal on metallic & non-metallic surfaces
4. Marking for low-voltage electrical appliances and refractory materials
5. Plastic marking covering raw stock to transparent materials; ideal for colored plastic processing
6. Marking on high-reflective metals (gold, silver, copper, etc.) and ceramics
7. Shallow surface ablation for electroplated, coated materials and nameplates
8. Micro-processing on tiny electronic components and wafers