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1. Compatibility with green, UV, infrared nanosecond lasers
2. Protective cover for effective laser radiation shielding
3. Can be internally equipped with visual positioning, XY motion platform and other optional configurations.
1. Marking of logos, model numbers, origin info on electronic products
2. Marking & micro-hole drilling on food, PVC pipes, pharmaceutical materials (HDPE, PO, PP, etc.), hole diameter d ≤ 10μm
3. Coating stripping of metallic & non-metallic materials
4. Marking for low-voltage electrical appliances, refractory materials
5. Plastic marking ranging from raw plastics to transparent materials, ideal for colored plastic processing
6. Marking on high-reflective metals (gold, silver, copper, etc.) and ceramics
7. Shallow surface ablation for electroplated, coated materials and nameplates
8. Micro-processing on tiny electronic components and wafers