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1. High-performance UV laser, minimal heat-affected zone, suitable for high-density and highly-integrated PCBA processing
2. Flying optical path system, compact structure and small floor space
3. High-precision motion system, scanning galvanometer and visual positioning system ensure stable machining accuracy
4. Large-format worktable to meet processing demands of oversized workpieces
Applied to precision cutting and grooving of PCBA, FPCA, LCP, rigid-flex boards, cover films, SIP packaged chips and other materials
Applied to precision processing of camera modules, packaged chips and other products, widely used in mobile digital products, wearable devices, automotive electronics and other areas