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Vacuum Plasma Cleaning Machine HPC-Vacuum
PLASMA-VP 110L

Vacuum Plasma Cleaning Machine

PLASMA-VP 110L

Machine Features

1. Efficient Cleaning for metal surfaces

2. Effective Surface Modification for the subsequent processes such as dispensing, bonding, adhesion, welding, coating, and encapsulation

3. The chamber capacity and number of layers can be customized according to customer requirements to meet specific needs.

Applications

Suitable for the printed circuit board (PCB) industry, semiconductor and IC fields, silicone, plastic, and polymer sectors, as well as the automotive, 3C electronics, and aerospace industries.

Brief Description

1. Adhesion Enhancement: Improves the reliability and durability of surface bonding.
2. Activation: Significantly increases surface wettability, creating an active surface.
3. Surface Modification: Enhances subsequent processes such as dispensing, bonding, adhesion, welding, coating, and encapsulation.
4. Cleaning: Removes organic contaminants, oxides, and trace oil residues from metal surfaces.
Technical Data Sheet

Machine Model

Vacuum Plasma Cleaning Machine PLASMA-VP 110L

Control system

PLC+ Touch Screen

Power

500W

Volume

110L(Option)

Electrode of plies

6

Working Gas

Two channels of working gas available for   selection: Ar, N, H, CF, O


Cleaning Results

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