Products Plasma Cleaning Machine Plasma Cleaning Machine
HPC-Inline

Inline Argon Plasma Cleaning Machine

HPC-Inline

Machine Features

1. Low-temperature argon plasma (38°C), ensuring no damage to chips or thin films.

2. Compatible gases: Argon (Ar), oxygen (O₂).

Applications

Cleaning and surface modification for LEDs, LCDs, ITO glass, PCB boards, and glass cover plates before AF (anti-fingerprint) coating.

Brief Description

Main Applications of Plasma Cleaning Equipment:
1. Adhesion Enhancement: Improves the reliability and durability of surface bonding.
2. Activation: Significantly increases surface wettability, creating an active surface.
3. Surface Modification: Enhances subsequent processes such as dispensing, bonding, adhesion, welding, coating, and encapsulation.
4. Cleaning: Removes organic contaminants, oxides, and trace oil residues from metal surfaces.

Processing Effects

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