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Ceramic Laser Cutting Machine

PLC3030 Series

Machine Features

1. Marble machine base, integrated enclosed structure, high stability

2. High-precision motion platform and control system, high speed & high accuracy

3. Premium laser source + customized cutting head; well-sealed optical path, fine focused spot, high cutting accuracy

4. High-precision CCD positioning system, ensures workpiece machining accuracy

5. Han’s Laser self-developed cutting software; customizable functions available for precision machining

Applications

1. Precision micro-machining for alumina, aluminum nitride, zirconia, beryllia ceramic substrates.

2. Precision cutting, scribing & hole cutting of LED ceramic substrates.

3. Precision machining of ceramic materials for IT products: mobile phone back panels, rear decorative parts.

Technical Data Sheet

Machine Model	Ceramic Laser Cutting Machine PLC3030 Series
X-Axis Travel（mm）	300
Y-Axis Travel （mm）	300
Z-Axis Travel（mm）	100
X/Y-Axis Max Rapid Travel Speed（mm/s）	800
Z-Axis Max Rapid Travel Speed（mm/s）	200
X/Y-Axis Positioning Accuracy（mm）	±0.005
X/Y-Axis Repositioning Accuracy（mm）	±0.002
Z-Axis Positioning Accuracy（mm）	±0.02
Z-Axis Repositioning Accuracy（mm）	±0.01
Laser Type	CO2 Laser/Fiber Laser
Laser Power（W）	CO2 Laser: 150、250
Laser Power（W）	Fiber Laser: 150、300、1500
Overall Machine Dimensions（Lmm×W mm×H mm）	145015002250
Net Machine Weight（kg）	Approx. 1900
Power Supply Requirement (Voltage fluctuation＜±5%）	Single-phase 220V, 50Hz, 60A (3-phase 380V optional)
Total Power Consumption (KW)	3~10
Relative Humidity	45%~75%
Ambient Temperature	10℃~30℃
Pneumatic Requirement (Clean & Dry)	0.8~2 MPa

Cookies Consent

Han's Laser Solutions

Ceramic Laser Cutting Machine

PLC3030 Series

Applications

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