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PECVD

Machine Features

1. Mature high‑throughput process, dual‑mode temperature control technology and thin-film passivation technology for silicon wafers; fast‑adaptive closed‑loop pressure control technology, plasma discharge‑field detection technology, and anti‑collision technology for wafer‑loading‑and‑unloading boat

2. Graphite‑boat electrode technology: surface‑contact of front‑side electrodes, regularly replaceable and cleanable electrode blocks, tail electrodes adjustable outside the furnace tube, enlarged electrode size and optimized electrode material, which efficiently resolve high frequent alarms

3. Fast‑cooling furnace body: the latest patented technology rapidly lowers furnace‑body temperature to the target value, raises the cooling rate by over 25% and greatly improves temperature uniformity inside the furnace tube

4. Patented parallel heat dissipation for boat‑storage stations: improves cooling efficiency and cuts cooling time by more than 15%; front-side air intake improves internal cleanliness of the operating console.

5. Integrated industrial PC and modular process‑control software

6. Comprehensive power‑failure safety protection and flange cooling‑water fault protection.

Applications

A layer of anti‑reflection silicon‑nitride (SiₓNᵧ) film with a thickness of 75‑140 nm is deposited on the silicon‑wafer surface. Meanwhile, H atoms and H radicals generated during deposition provide surface and bulk passivation for the silicon wafer. The coating reduces optical reflection and extends the minority‑carrier lifetime of wafers, thereby improving the conversion efficiency of crystalline‑silicon solar cells. This process is mainly utilized for front and rear side silicon‑nitride film deposition of PERC and TOPCon cells.

TOPCon Cell Process

Technical Data Sheet

Machine Model	PECVD
Deposition Film Types	AlO,SiO,SiON,SiN,SiC
Batch Loading Capacity	768pcs/batch(182mm),616pcs/batch (210mm),500pcs/batch (230mm)
Alumina Film Thickness Uniformity	Intra-wafer≤6% Inter-wafer≤6% Inter-batch≤5% (182mm wafers)
Alumina Refractive Index	1.65(±0.05)
UP-TIME	≥98%
Operating Temperature Range	100~600℃
Temperature Control	9-point temperature control, dual-mode internal/external control
Heating Mode	Automatic ramp heating with rapid constant temperature function
Cooling Mode	Latest patented technology, 9-zone segmented active cooling furnace body
Constant Temperature Zone Accuracy & Length	±2°C/3200mm(500°C)
Single-point Temperature Stability	<±1°C/4h(500°C)
Heating Time	RT→450℃≤45min
Temperature Control	Dual-mode precision control
System Ultimate Vacuum	<3Pa
System Leak Rate	Pressure rise rate<1Pa/min after pump stop and valve closure
Pressure Control Method	Fast-adjusting fully automatic closed-loop
Process Control Method	Fully automatic process control with multiple safety interlock alarms
HMI	LCD display, touch operation, recipe editing, online monitoring, permission management, shift management, networking function
MES/CCRM	Available

Sales Hotline

+86-400-666-4000