LPCVD Coating Machine

Machine Features

1. Mature high-throughput process, dual-mode temperature control technology, thin-film silicon protection technology

2. Diverse coating technologies available: multi-layer composite film, doped polysilicon technology

3. Patented rapid cooling furnace body: The latest patented technology enables fast temperature reduction to set value, with cooling rate increased by over 25% and greatly improved temperature uniformity inside furnace tubes

4. Fast adaptive closed-loop pressure control technology

5. Fully structured and high-performance MES/CCRM system

6. All-in-one industrial controller + modular process control software

7. Comprehensive power failure safety protection and flange water abnormality protection

Applications

Suitable for semiconductor and photovoltaic industries. For TOPCon cell production in PV field, the LPCVD equipment realizes one-stop fabrication of tunnel oxide layer and polysilicon layer. Combining thermal oxidation and polysilicon deposition greatly boosts throughput, and it is compatible with intrinsic/doped polysilicon growth processes.

TOPCon Cell Process

Technical Data Sheet

Film Types	SiOx, i/d-Poly-Si
Wafer Loading Size	Vertical loading: 2880 pcs/batch (182mm),2200 pcs/batch (210mm)
Film Thickness Uniformity	SiOx Uniformity: Adjustable thickness 1–3 nm, accuracy 0.1 nm. SiOx thickness tested with polished wafers. Poly Uniformity: Adjustable thickness 50–200 nm, accuracy 1 nm. Poly thickness tested with polished wafers. Within-wafer: ≤4%; Wafer-to-wafer: ≤4%; Batch-to-batch: ≤3% (for thickness >100 nm))
Up-Time	≥95%
Operating Temperature	400-750℃
Temperature Control	6-point temperature control, internal & external dual-mode control
Heating Mode	Automatic ramp heating & rapid temperature stabilization
Cooling Mode	Patented technology, active cooling furnace with 6-zone segmented control
Accuracy & Length In Constant Temperature Zone	±1℃/2800mm(550-700℃)
Single-Point Temperature Stability	1±℃/6H
Heating Time	RT→750℃≤45min
Cooling Rate	≥5℃/min
Temperature Control	Dual-mode Precision Control
Ultimate System Vacuum	<3Pa
System Leak Rate	Pressure Rise Rate (Pump Stop & Valve Closed)<2Pa/min
Pressure Control Mode	Fast adjustment, fully automatic closed-loop control
Process Control Mode	Fully automatic process control, multi-interlock safety alarm
HMI	LCD display, touch operation, process editing, on-line monitoring, authority management, team management, networking function
Mes/Ccrm	Supported

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Sales Hotline

+86-400-666-4000