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Laser Film‑Opening Machine

Machine Features

1. The opening patterns can be freely configured as required, including solid lines, dashed lines, dot patterns, etc.

2. The standard model adopts dual‑lane structure with high‑level automation. It enables upgrade of existing production lines with low cost and high reliability.

Applications

Suitable for PERC & IBC cells, applicable to monocrystalline and polycrystalline silicon cells. It etches the back‑passivation film of PERC solar cells to form windows for ohmic‑contact paste.

TOPCon Cell Process

Technical Data Sheet

Machine Model	Laser Film‑Opening Machine
Laser	Green laser
Spot Size	30±5μm circular
Processing Pattern & Pattern Accuracy	Solid line, dashed line, dot‑matrix; ≤±15μm
Processing Wafer Size	156mm×156mm~210mm×210mm
Machine Throughput	7200-9000p/h@182mm(standard model)； 6500-7000p/h@210mm(standard model); customizable
Laser Service Life	>20000 h
Breakage Rate	≤0.02%
Wafer Inspection	Pre‑inspection: industrial camera≥10 MP post‑inspection optional
Operation Mode	Dual‑lane operation, two lanes work independently without mutual interference
Dust‑removal & Filtration Efficiency	Dust‑removal efficiency＞95 %, dust filtration efficiency＞99 %
Loading Mode	Side‑by‑side / same‑side loading & unloading optional
Control System	PLC+Industrial PC
HMI	LCD display, touch operation, on‑line monitoring, authority management, etc.
MES	MES Interface Available

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Sales Hotline

+86-400-666-4000