

1. Low power laser, rear focusing, integrated equipment
2. Adjustable optical girder, extensive processing of plane, air cooling
3. Widely applied to graphics and texts marking of gifts and crafts, food packaging, electronic components, PCB bar code, FPCB, ceramic substrate, semiconductor, crystal glass, plastic connector, rubber button, SMD component and other materials.
This machine is able to engrave non-metallic materials and partial metal materials and is widely applied to marking for food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, button, textile cutting, gifts and crafts, rubber products, electronic components, PCB bar code, FPCB, ceramic substrate, semiconductor, crystal glass, plastic connector, SMD component and other materials.
Machine Model | CO2-H55i | CO2-D30 | CO2-G10 | |
Laser Characteristics | CO2 Laser | |||
Largest Power | 55W | 30W | 10W | |
Power Stability | ±5% | ±5% | ±10% | |
Marking Area | 85mm*85mm | 50mmx50mm | ||
Engraving Speed | ≤3m/s | |||
Min. Line Width | 0.12mm | 0.05mm | ||
Min. Character | 0.6mm | 0.2mm | ||
Repeated Position | ±0.01mm | |||
Protection Level | IP54 | |||
Cooling Mode | Air cooling | |||
Power Supply Voltage | 220V/10A | 220V/10A | 220V/10A | |
Power Consumption | 2kW | 900W | 300W | |
Best Working Environment | Temperature | 15℃-30℃ | ||
Humidity | 45%-75% | |||
Dimension (L*W*H) | Optical System | 1120x620x1370mm | ||
Control System | Integrated machine | |||
Cooling System | Air cooling | |||
Weight | Optical System | 110kg | ||
Control System | Integrated machine | |||
Cooling System | Air cooling | |||