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1. Adopts parallel layout. UPH increases by more than 10% compared with conventional inline dispensing platforms.
2. Equipped with inline AOI inspection to avoid mass defects.
3. Quick replacement of dispensing needles.
4. Class 100 dust cleanliness, Class A vibration resistance; precise glue control and stable glue output.
5. Easy operation.
Excellent for dispensing processes for the following working procedures:
Hot melt adhesive bonding
Underfill
Surface mount technology (SMT)
Stack packaging
Dam and fill
Reinforcing material dispensing