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Wafer Sorting Taping and Reeling Machine

Machine Features

1. Fully‑Automatic Loading and Unloading

2. High‑speed component processing, hourly capacity up to 40K

3. Adopts dual high‑speed DD‑motors and is fitted with 16 vacuum nozzles

4. Automatic ARC rewinding; Fully‑automatic nozzle alignment

5. High‑precision six‑sided AOI inspection; Infra‑red optical system

6. Inspection System: Taping‑reel positioning inspection; Indentation inspection; Six‑sided inspection; Taping‑material inlet‑side inspection

Applications

The equipment is primarily used for the final‑stage procedure of front‑end manufacturing for surface‑mount semiconductor devices. It can automatically accomplish component sorting and screening, mark inspection, outline‑dimension detection, taping‑and‑reeling packaging output and post‑packaging indentation inspection. It is mainly applied to the taping‑and‑reeling packaging process of WCLSP components, LED chips and wafer dies in the semiconductor industry.

Semiconductor Industry

Technical Data Sheet

Machine Model	Wafer Sorting Taping and Reeling Machine
Inspection Functions	Six‑sided inspection
	Indentation inspection
	Carrier‑tape front‑side inspection
Number of Nozzles	16 nozzles
Placement Accuracy	±25um
Bin	2 reject bins
Loading Method	Automatic wafer loading
Wafer Sizes	4‑inch, 6‑inch, 8‑inch, 12‑inch
Die Dimension	0.2x0.4 mm to 9.0x9.0mm
Die Thickness	0.1mm up to 1.5 mm
UPH	40K
ARC‑Automatic Reel‑change	Available
Infrared Optical System	Available

Sales Hotline

+86-400-666-4000