Cookies Consent

Han's Laser uses cookies to optimise website operation, enhance browsing experience, collect statistical analysis data and deliver interest-based advertisements.

Your cookies data could be temporarily shared with companies outside the EEA during processing. If the European Commission has not granted an adequacy decision confirming that the relevant third country maintains sufficient data protection safeguards, authorities may gain access to your transferred data for control and monitoring. In such cases, you may lack viable legal channels to claim your rights or seek effective redress.

Selecting "Accept All Cookies" constitutes your consent to the implementation of all cookies throughout the Han's Laser website, including statistical analytics cookies. The “Only Required Cookies” option enables you to restrict usage to essential functional cookies free of analytical tracking. You may also customise your cookie preferences at any time through the “Settings” link. For detailed information, please refer to our Privacy Policy.

Required Cookies (Necessary)

Optional Cookies (statistical analytics cookies)

Enabling this setting confirms your approval for cookie implementations throughout the Han’s Laser website, together with the transfer of your personal data to third countries. You may withdraw this authorisation via this interface at any time. Kindly note that all data processing undertaken pursuant to this consent shall remain legally valid prior to your withdrawal.

Wafer Scrubbing and Cleaning Machine

SC12-XC4S001A

Machine Features

1. The cleaning machine provides continuous‑stable liquid output to ensure process quality and throughput.

2. High‑intensity megasonic energy is adopted without pattern damage to strengthen the impact force of liquid molecules so as to remove contaminants within deep holes and deep trenches.

3. Steady control over liquid flow rate, liquid pressure, temperature and other parameters ensures quality consistency.

Applications

It is mainly applied to compound semiconductors, power devices, MEMS, advanced packaging, RF integrated circuits, Micro‑LEDs, optical‑glass and other fields.

Semiconductor Industry

Technical Data Sheet

Machine Model	Wafer Scrubbing and Cleaning Machine SC12-XC4S001A
Wafer Cassette Quantity	2CS&2LP
Configuration	4 cleaning units
wafer Type	Round wafers, square wafers
wafer Size（mm）	50-300
Throughput（WPH）	120（(front‑side）
Chemical Reagents	IPA、weak‑acid and weak‑alkaline、DIW
Substrate Materials	Si、Glass、Sapphire、GaN、GaAs、SiC、LiTaO3、Li3PO4
Applicable Processes	Pre/Post clean
Drying Mode	Spin Dry+N2 Dry

Sales Hotline

+86-400-666-4000