Cookies Consent

Required Cookies (Necessary)
Optional Cookies (statistical analytics cookies)

Enabling this setting confirms your approval for cookie implementations throughout the Han’s Laser website, together with the transfer of your personal data to third countries. You may withdraw this authorisation via this interface at any time. Kindly note that all data processing undertaken pursuant to this consent shall remain legally valid prior to your withdrawal.

Privacy Policy Legal Statement
Wafer‑Level Femtosecond‑Laser TGV Equipment
Applications

Wafer‑Level Femtosecond‑Laser TGV Equipment

Machine Features

1. Flexible dimensional compatibility, supporting all‑specification wafers under 300 mm

2. Femtosecond‑laser‑enabled machining for high throughput and superior processing quality

3. Self‑developed process‑and‑control system

4. Integrated high‑precision automatic wafer alignment system

5. Fully‑automatic unattended operation

6. Numerous proprietary intellectual‑property rights and core technologies.


Applications

Han's Laser self‑developed TGV (Through‑Glass Via) processing equipment delivers stable and reliable performance in mass production. It is widely used for machining multi‑size blind holes, profile‑shaped holes and conical holes, and possesses broad application potential in advanced packaging, display manufacturing, consumer‑electronics and life‑science industries.


OLED & LCD Panel Industry
Semiconductor Industry
Technical Data Sheet

Machine Model

Wafer‑Level   Femtosecond‑Laser TGV Equipment

Max. Machining Size

12‑inch

Hole Positioning Accuracy

3μm

Operating Speed

≥800mm/s

Hole Roundness

(Outer‑hole & Inner‑hole)

≥95% (major‑axis / minor‑axis)

Hole‑wall Surface Roughness

≤100nm (subject to workpiece material   and etching performance)


Recommended Products
Contact
Contact Us
Phone
Sales Hotline
+86-400-666-4000
Top