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Standard Photoresist Coating and Developing System CD06-XS2C2D1A

Machine Features

1. Widely applied to photoresist coating and developing processes of silicon, SiC, GaN, GaAs, glass and other materials

2. Supports processes above 0.35 μm, wafer size from 2‑inch to 6‑inch, and is compatible with photoresist ranging from 3‑20000 CP

3. High‑precision control, EtherCAT communication, high‑precision swing arm and wafer‑transfer mechanism

4. Self‑developed software system to support customized requirements

5. Compact footprint, outstanding stability, easy operation and maintenance.

Applications

Photoresist coating and developing for Compound‑Semiconductors, Power‑Devices, MEMS, RF‑ICs, LEDs, Research‑based Projects and Optical‑Components

OLED & LCD Panel Industry

Technical Data Sheet

Machine Model	Standard Photoresist Coating and Developing System CD06-XS2C2D1A
Cassette	2 & 3CS
wafer Type	Round Wafers, Square Substrates
wafer Size（mm）	50-150
Throughput（WPH）	110
Substrate Materials	Si、Glass、Sapphire、GaN、GaAs、SiC、LiTaO3、Li3PO4
Processes	g-line、i- line、PI

Sales Hotline

+86-400-666-4000