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Standard Photoresist Coating and Developing System CD06-XS2C2D1A
Applications

Standard Photoresist Coating and Developing System CD06-XS2C2D1A

Machine Features

1. Widely applied to photoresist coating and developing processes of silicon, SiC, GaN, GaAs, glass and other materials

2. Supports processes above 0.35 μm, wafer size from 2‑inch to 6‑inch, and is compatible with photoresist ranging from 3‑20000 CP

3. High‑precision control, EtherCAT communication, high‑precision swing arm and wafer‑transfer mechanism

4. Self‑developed software system to support customized requirements

5. Compact footprint, outstanding stability, easy operation and maintenance.


Applications

Photoresist coating and developing for Compound‑Semiconductors, Power‑Devices, MEMS, RF‑ICs, LEDs, Research‑based Projects and Optical‑Components


OLED & LCD Panel Industry
Technical Data Sheet

Machine   Model

Standard   Photoresist Coating and Developing System CD06-XS2C2D1A

Cassette

2 &   3CS

wafer Type

Round   Wafers, Square Substrates

wafer Size（mm）

50-150

Throughput（WPH）

110

Substrate   Materials

Si、Glass、Sapphire、GaN、GaAs、SiC、LiTaO3、Li3PO4

Processes

g-line、i- line、PI


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