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SiC Wafer Stealth Dicing Machine

Machine Features

1. Custom‑engineered laser system; excellent dicing performance

2. Fully‑automatic production; ultra‑precision motion stage

3. High‑precision vision system with automatic alignment and auto‑focus search

4. Compatible with 4‑inch / 6‑inch wafers

5. SECS/GEM interface

Applications

Stealth‑dicing machine for SiC, GaN, LT and LN wafers

Semiconductor Industry

Technical Data Sheet

Machine Model	SiC Wafer Stealth Dicing Machine
Wafer Size	4inch/6inch Wafer
Processing Speed	400-1000mm/s
Processing Accuracy	±1μm
Stage Parameters	Travel Range: 300mm×300mm Repositioning Accuracy: ±0.001mm θ-Axis Repositioning Accuracy: ±2arcsec
Laser Parameters	Infrared
Equipment Utilization	>98%
Mean Time Between Critical Failures (MTBCF)	＞1000H
Yield	≥99.5%

Sales Hotline

+86-400-666-4000