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SiC Wafer Stealth Dicing Machine
Applications

SiC Wafer Stealth Dicing Machine

Machine Features

1. Custom‑engineered laser system; excellent dicing performance

2. Fully‑automatic production; ultra‑precision motion stage

3. High‑precision vision system with automatic alignment and auto‑focus search

4. Compatible with 4‑inch / 6‑inch wafers

5. SECS/GEM interface


Applications

Stealth‑dicing machine for SiC, GaN, LT and LN wafers


Semiconductor Industry
Technical Data Sheet

Machine   Model

SiC   Wafer Stealth Dicing Machine

Wafer   Size

4inch/6inch   Wafer

Processing   Speed

400-1000mm/s

Processing   Accuracy

±1μm

Stage   Parameters

Travel   Range: 300mm×300mm
  Repositioning Accuracy: ±0.001mm
  θ-Axis Repositioning Accuracy: ±2arcsec

Laser   Parameters

Infrared

Equipment   Utilization

>98%

Mean Time Between Critical Failures   (MTBCF)

＞1000H

Yield

≥99.5%


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