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SDBG Process Laser Stealth Dicing Machine
Applications Display & Semiconductor

SDBG Process Laser Stealth Dicing Machine

Machine Features

1. The light‑source system developed for the properties of silicon material achieves high‑precision internal modification cutting.

2. Equipped with a far‑infrared back‑penetrating vision system for the back‑side cutting process of silicon wafers.

3. FOUP loading and high‑efficiency wafer transportation by robotic handler.

4. Industrial vision enables fast identification of wafer contour and notch.

5. Fully‑automatic operation for 12‑inch wafers.

6. Complies with SEMI standards and supports SECS‑GEM communication.


Applications

It is mainly adopted for the cutting procedure during the SDBG process of thin‑chip wafers. It supports the cutting of Flash, DRAM and other wafers and is applied to Flash Memory, Memory Controller and other fields.


Semiconductor Industry
Technical Data Sheet

Machine Model

SDBG Process Laser Stealth Dicing Machine

Wafer Substrate

Si Substrate

Wafer Size

12‑inch

X-Y Travel Range

600mm×600mm

Cutting Speed

400mm-2000mm/s

Positioning Accuracy

Repositioning accuracy：±1μ   

Positioning Accuracy：±1μm

Transmission System

Load port, robot, aligner

Overall Dimensions (LxWxH)

2940mm*1600mm*2200mm


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Phone
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+86-400-666-4000
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