Cookies Consent

Required Cookies (Necessary)
Optional Cookies (statistical analytics cookies)

Enabling this setting confirms your approval for cookie implementations throughout the Han’s Laser website, together with the transfer of your personal data to third countries. You may withdraw this authorisation via this interface at any time. Kindly note that all data processing undertaken pursuant to this consent shall remain legally valid prior to your withdrawal.

Privacy Policy Legal Statement
SDBG Process Laser Stealth Dicing Machine
Applications

SDBG Process Laser Stealth Dicing Machine

Machine Features

1. The light‑source system developed for the properties of silicon material achieves high‑precision internal modification cutting.

2. Equipped with a far‑infrared back‑penetrating vision system for the back‑side cutting process of silicon wafers.

3. FOUP loading and high‑efficiency wafer transportation by robotic handler.

4. Industrial vision enables fast identification of wafer contour and notch.

5. Fully‑automatic operation for 12‑inch wafers.

6. Complies with SEMI standards and supports SECS‑GEM communication.


Applications

It is mainly adopted for the cutting procedure during the SDBG process of thin‑chip wafers. It supports the cutting of Flash, DRAM and other wafers and is applied to Flash Memory, Memory Controller and other fields.


Semiconductor Industry
Technical Data Sheet

Machine Model

SDBG Process Laser Stealth Dicing Machine

Wafer Substrate

Si Substrate

Wafer Size

12‑inch

X-Y Travel Range

600mm×600mm

Cutting Speed

400mm-2000mm/s

Positioning Accuracy

Repositioning accuracy：±1μ   

Positioning Accuracy：±1μm

Transmission System

Load port, robot, aligner

Overall Dimensions (LxWxH)

2940mm*1600mm*2200mm


Recommended Products
Contact
Contact Us
Phone
Sales Hotline
+86-400-666-4000
Top