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Photoresist Stripping Machine

LF12-XS3MRS1A

Machine Features

1. Combining tank‑soaking treatment with single‑wafer spin‑spraying to improve processing capacity

2. High‑pressure or two‑fluid spraying achieves complete photoresist stripping

3. Substrate workflow: dry‑in, wet‑transfer, dry‑out

4. Photoresist stripper is recovered, circulated, filtered and reused to reduce operating costs

5. Precious‑metal recycling function

Applications

Mainly adopted for photoresist‑stripping processes of compound semiconductors, power devices, MEMS, advanced packaging, RF integrated circuits, Micro‑LEDs and optical‑glass substrates

Semiconductor Industry

Technical Data Sheet

Machine Model	Photoresist‑Stripping Machine LF12-XS3MRS1A
Cassette Quantity	2CS&2LP
Configuration	1Soak+1Stripper+1Cleaning
Wafer Type	Round Wafers, Square Wafers
Wafer Size (mm)	50-300
Throughput（WPH）	40
Chemical Solvents	NMP、DMSO
Substrate Material	Si、Glass、Sapphire、GaN、GaAs、SiC、LiTaO3、Li3PO4
Applicable Processes	Lift-Off、Stripper
Drying Mode	Spin Dry+N2 Dry

Sales Hotline

+86-400-666-4000