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Panel‑Level Femtosecond Laser TGV Etching Equipment for Reinforced Glass

Machine Features

1. Max. processing area: 730 mm × 920 mm, with flexible compatibility for various substrate sizes.

2. Femtosecond laser enables high‑throughput processing with superior quality.

3. Self-developed processing and control systems.

4. Integrated high‑precision automatic alignment and compensation system.

5. Fully automatic unattended operation.

6. Backed by multiple patents and proprietary core technologies.

Applications

Mainly used for through‑glass via (TGV) etching of reinforced glass.

OLED & LCD Panel Industry

Semiconductor Industry

Technical Data Sheet

Machine Model	Panel‑Level Femtosecond Laser TGV Etching Equipment for Reinforced Glass
Max. Processing Size	730x920mm
Hole Position Accuracy	5μm
Travel Speed	≥800mm/s
Hole Roundness (Outer‑hole & Inner‑hole)）	≥95% (Major‑axis / Minor‑axis)
Hole‑wall Surface Roughness	≤100nm (Subject to material and etching capacity)

Sales Hotline

+86-400-666-4000