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1. Applied to the lithography process in the production of 4‑6‑inch substrate‑based LED silicon chips and sapphire chips.
2. Adopting an ultra‑large exposure field, the equipment cuts down number of exposures and improves production efficiency.
3. High resolution and excellent line‑width uniformity.
LED Wafer
Machine Model | LED Stepper Lithography Machine |
Wafer Size | 4 inch and 6 inch Wafers |
Processing Speed | 4 inch, 137pcs/h |
Processing Accuracy | Resolution: 2μm L/S |
Positioning Accuracy |
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Laser‑source Parameters | Laser Source:2000W UV Lamp,Wavelength 365nm |
Tact time | 4 inch:43.1 s (first wafer), cycle‑time TT: 25.6 s |
Equipment Utilization | >95% |