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LED Laser Lift-off Equipment

Machine Features

1. Long depth‑of‑focus to cope with wafer warpage

2. High‑precision processing system

3. Fully automatic loading and unloading for high speed processing

4. Low‑damage machining and high yield

5. Real‑time adjustment and storage of process‑parameters are supported.

Applications

Laser lift‑off processing for flat substrates of silicon‑base or metal, and DPSS wafers.

LED Industry

Technical Data Sheet

Machine Model	Led Laser Lift-off Equipment
Workpiece Size	4/6 inch Wafer
Processing Speed	2400~3200mm/s
Processing Accuracy	±1.5μm
Stage	400*600mm
Laser Frequency	200khz
Tact Time	140s (4-Inch Wafer, Excluding Loading/Unloading)
Equipment Utilization Rate	98%
Mean Time Between Critical Failures (MTBCF)	≥ 2 Hours
Production Yield	95%
Galvo & Control System	Max. Speed: 5000mm/S Accuracy：±10μm
Processing Mode	Spiral Inward + Circular Linear Filling

Sales Hotline

+86-400-666-4000