Cookies Consent

Han's Laser uses cookies to optimise website operation, enhance browsing experience, collect statistical analysis data and deliver interest-based advertisements.

Your cookies data could be temporarily shared with companies outside the EEA during processing. If the European Commission has not granted an adequacy decision confirming that the relevant third country maintains sufficient data protection safeguards, authorities may gain access to your transferred data for control and monitoring. In such cases, you may lack viable legal channels to claim your rights or seek effective redress.

Selecting "Accept All Cookies" constitutes your consent to the implementation of all cookies throughout the Han's Laser website, including statistical analytics cookies. The “Only Required Cookies” option enables you to restrict usage to essential functional cookies free of analytical tracking. You may also customise your cookie preferences at any time through the “Settings” link. For detailed information, please refer to our Privacy Policy.

Required Cookies (Necessary)

Optional Cookies (statistical analytics cookies)

Enabling this setting confirms your approval for cookie implementations throughout the Han’s Laser website, together with the transfer of your personal data to third countries. You may withdraw this authorisation via this interface at any time. Kindly note that all data processing undertaken pursuant to this consent shall remain legally valid prior to your withdrawal.

LED Laser Lift-off Equipment

Machine Features

1. Long depth‑of‑focus to cope with wafer warpage

2. High‑precision processing system

3. Fully automatic loading and unloading for high speed processing

4. Low‑damage machining and high yield

5. Real‑time adjustment and storage of process‑parameters are supported.

Applications

Laser lift‑off processing for flat substrates of silicon‑base or metal, and DPSS wafers.

LED Industry

Technical Data Sheet

Machine Model	Led Laser Lift-off Equipment
Workpiece Size	4/6 inch Wafer
Processing Speed	2400~3200mm/s
Processing Accuracy	±1.5μm
Stage	400*600mm
Laser Frequency	200khz
Tact Time	140s (4-Inch Wafer, Excluding Loading/Unloading)
Equipment Utilization Rate	98%
Mean Time Between Critical Failures (MTBCF)	≥ 2 Hours
Production Yield	95%
Galvo & Control System	Max. Speed: 5000mm/S Accuracy：±10μm
Processing Mode	Spiral Inward + Circular Linear Filling

Recommended Products

Sales Hotline

+86-400-666-4000