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Laser Ring-Cutting and Cleaning Integrated Machine

Machine Features

1. The machine integrates multiple‑process functions: laser ring‑cutting, notch cutting, hole drilling, slot grooving, ID marking transfer and cleaning.

2. High‑precision recognition and positioning for wafer outline and notch.

3. 2D/3D vision inspection for cutting accuracy and cutting depth during machining.

4. FOUP feeding, high‑efficiency wafer handling by robotic handler.

5. Fully‑automatic operation for 12‑inch wafers.

6. Conforms to SEMI standards and supports SECS‑GEM communication.

Applications

This machine delivers an integrated solution covering precision laser ring‑cutting, notch cutting, hole drilling, slot grooving, ID transfer and cleaning for the processing of moulded packages of semiconductor integrated circuits.

Semiconductor Industry

Technical Data Sheet

Machine Model	Laser Ring‑Cutting and Cleaning Integrated Machine
Working Material	EMC
Wafer Size	12inch
Ring‑Cutting Width Specification	>150μm，adjustable
Ring‑Cutting Width Tolerance	±30μm
ID Transfer Depth	>5μm，adjustable
ID Transfer Width Tolerance	±10μm
Notch Cutting Accuracy	Size：±20μm，Angle：±3°
Molding Groove Plane‑Dimension Accuracy	±10μm
Molding Groove Depth Accuracy	±20μm
Transmission System	Loadport、Robot、Aligner
Overall Dimensions (LxWxH)	3000mm2240mm2380mm

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Sales Hotline

+86-400-666-4000