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Fully-Automatic Wafer Test-and-Sorting Machine

Machine Features

1. Fully‑automatic loading and unloading; processed by high‑speed rotary motor with an hourly output up to 8,000 pieces

2. 24 horizontally‑mounted nozzles with independent control for each unit, and a 4×4 nozzle layout in the vertical direction

3. 4 sorting bins，electrical testing function equipped, multiple‑time bin classification supported

4. High‑precision AOI inspection system

5. Built‑in MES module for full‑lifecycle traceability of product data

Applications

The equipment is primarily adopted for wafer‑level testing and post‑packaging test procedures. It evaluates chip performance and quality so that the qualified chips can be proceeded to subsequent packaging workflows. Main inspection items cover electrical indicators and AOI wafer inspection.

Inspected wafers are graded and then placed inside trays for packaging. It serves chip testing for high‑end sectors including industrial, automotive and aerospace industries.

Semiconductor Industry

Technical Data Sheet

Machine Model	Fully-Automatic Wafer Test-and-Sorting Machine
Inspection Function	Six‑sided inspection
Placement Accuracy	±100um
Number of Bins	4 Bins (A / B / C / D)
Loading Method	Automatic wafer loading
Unloading Method	Tray, waffle pack, etc.
Wafer Size	4", 6", 8", 12"
Die Size	0.5x0.5 mm to 30.0x30.0mm
Die Thickness	0.1mm up to 1.5 mm
UPH	8K-24K
Testing Function	Supported
Secondary Bin Sorting	Supported
Infrared Optical System	Supported

Sales Hotline

+86-400-666-4000