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Fully-Automatic Laser Cutting Equipment

Machine Features

1. Self‑developed multi‑optical‑path system, compatible with the processing of multi‑material wafers

2. Automatic adhesive‑coating and cleaning system for precise control over adhesive consumption

3. Multi‑stage filtration system that effectively captures toxic dust and ensures operator safety

4. High‑quality hardware and software to ensure the consistency of parameter data

5. SEMI‑S2‑certified equipment, conforming to SEMI specifications

Applications

It is mainly applied to the cutting process of VCSEL chips and bar‑shaped workpieces in the semiconductor industry, and supports laser cutting for gallium arsenide, indium phosphide and silicon wafers.

Semiconductor Industry

Technical Data Sheet

Machine Model	Fully-Automatic Laser Cutting Equipment
Machinable Materials	GaAs, InP, Si
Workpiece Size	4inch, 6 inch, 8 inch
Workpiece Thickness	50um-200um
Positioning Accuracy	Straightness：±1μm，Repositioning Accuracy：±1μm
Laser Wavelength	355nm,1064nm
(L × W × H)	1140mm×1740mm×1750mm

Sales Hotline

+86-400-666-4000