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Fully Automatic Compound Cleaving Line (Scribing, Cleaving, Laminating)

Machine Features

1. The brightness of light sources at different positions can be set independently according to product functions, effectively addressing product discrepancies.

2. Main functions: Magazine loading (25 iron rings), compound cleaving & scribing, fully automatic film laminating and fully automatic cleaving.

3. Equipped with industrial vision system for efficient recognition of wafer contours and notches.

4. Supports fully automatic operation for various products including wafers, bars, potassium nitride bars and cells.

5. Compliant with SEMI standards and SECS-GEM communication protocol.

Applications

Our key equipment models serve multiple chip segments such as optical devices, laser chips and optical communication chips.

LED Industry

Technical Data Sheet

Parameter	Value
Substrate Material	GaAs, InP, GaN, SiC, Si and other substrates
Processing Size	4/6/8 inch
Bar Chips	Bar dimension: 4.5mm30mm; Single chip: 0.10mm4.5mm
X-Y Travel Range	160mm*160mm
Positioning Accuracy	Repeat positioning accuracy: ±2μm; Positioning accuracy: ±2μm
Transmission System	Load port, robot, aligner

Sales Hotline

+86-400-666-4000