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Front-end Photoresist Coating and Developing System

CD12-XC6C6D1A

Machine Features

1. Stack‑type high‑throughput structure with a compact footprint

2. Equipped with a multi‑chamber shared photoresist supply system with multi‑stage back‑suction to lower photoresist consumption

3. Optional components including high‑precision hot plate, WEE and AOI units to satisfy higher standard process requirements

4. Modular‑designed core units support flexible configurations and customization

5. Satisfy factory automation demands

6. Achieves inline connection with mainstream lithography tools

Applications

Applied to the processing of compound semiconductors, power devices, MEMS, RF integrated circuits and LEDs

Semiconductor Industry

Technical Data Sheet

Machine Model	Front-end Photoresist Coating and Developing System CD12-XC6C6D1A
Wafer Cassette Quantity	4LP
wafer Type	Round Wafers
wafer 尺寸（mm）	200,300
Throughput（WPH）	120
Substrate Materials	Si、Glass
Applicable Processes	PI、I- line、Barc、SOG、SOC、KrF

Sales Hotline

+86-400-666-4000